Close to the heart of the action in the hot press: GreCon added EASYLOG to the CONTILOG product family to measure gas pressure and temperature. This smaller chip measures the temperature of wood based panels (MDF, particleboard, OSB) during hot pressing.
A wireless sensor, 2.5 mm flat, is placed in a wood based mat as a so-called lost component and runs through the hot press to measure the temperature for the entire pressing procedure. After leaving the press, the measured data is wirelessly read out with a reader and transferred to a PC for evaluation using a USB stick.
The mat temperature of any position within the press provides information on the curing of the resin in the mat. The press program for the individual panel types can be optimised to reach a core layer temperature of 100 °C as soon as possible.
The EASYLOG is also suitable for continuous monitoring of the conditioning of thin wood based panels during cooling.
New Features and Benefit
- Suitable for thin panels (from 10 mm)
- Measures the mat temperature in any position within the press
- Provides information on the curing of the resin in the mat
- Reduces press run-in times
- Intuitive control with touch-screen tablet PC