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LIGNA 2019, 27 - 31 May

I-BOND®

Logo Huntsman (Europe)

Exhibitor

Huntsman (Europe)

Exhibitor details
Exhibitor details
Logo I-BOND®

Product description

Huntsman's team of experts has developed the I-BOND® family of fast curing MDI resins to provide tailored and cost effective solutions for the composite wood panel industry.

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast curing resins; they are used for bonding Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB) and Wood Fiber Insulation Board (WFI).

Composite wood panels made with I-BOND® MDI contain no added formaldehyde and comply with the most stringent standards.

Product website

Hall 26, Stand B61

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