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LIGNA 2019, 27 - 31 May

I-BOND®

Huntsman (Europe)

Exhibitor details
Logo I-BOND®

Exhibition stand

Hall 26, Stand B61
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Product description

Huntsman's team of experts has developed the I-BOND® family of fast curing MDI resins to provide tailored and cost effective solutions for the composite wood panel industry.

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast curing resins; they are used for bonding Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB) and Wood Fiber Insulation Board (WFI).

Composite wood panels made with I-BOND® MDI contain no added formaldehyde and comply with the most stringent standards.

Product website

All products offered by this exhibitor

I-RELEASE®

The I-RELEASE® internal and external release systems complement the I-BOND® range. They are designed to make the production process for the following applications run smoother: Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB) and Wood Fiber Insulation (WFI)read more

I-BOND®

Huntsman's team of experts has developed the I-BOND® family of fast curing MDI resins to provide tailored and cost effective solutions for the composite wood panel industry. I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast curing resins; they are used for bonding Oriented Strand ...read more

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