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LIGNA 2021, 10 - 14 May
Homepage>Conference program >WOOD YOU? CAN YOU?
Hack the Wood

WOOD YOU? CAN YOU?

Location & Language

Pavilion P36

Language

English

Event Details

Type of event

Pitch

Topic

Integrated Manufacturing, Machine Components and Automation Technology, Surface Technology

Event series

Hack the Wood

Event Host

Missed the Event?

So far no information materials were provided for this event. Please contact the organizer directly for further information.

Description

tapio helps the wood industry to jump into the digital world. The company´s first hackathon “Hack the wood” will help to realize this vision by tackling five real-world challenges provided by four partners Henkel, Hettich, HOMAG and Venjakob (all using the tapio technology platform):
1. AI and image / video recognition
2. Future of machine integration
3. Bridging analog and digital worlds
4. Solving Connections
5. Connecting the digital worlds
The hackathon itself will be held in Berlin, but on May 28th the participants will pitch their solutions in front of an expert jury during LIGNA – the ideal stage and a vibrant location to showcase the ideas to companies who care about solutions.

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