27 - 31 May
Huntsman's team of experts has developed the I-BOND® family of fast curing MDI resins to provide tailored and cost effective solutions for the composite wood panel industry.
I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast curing resins; they are used for bonding Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB) and Wood Fiber Insulation Board (WFI).
Composite wood panels made with I-BOND® MDI contain no added formaldehyde and comply with the most stringent standards.
The I-RELEASE® internal and external release systems complement the I-BOND® range. They are designed to make the production process for the following applications ...