Advertisement
Advertisement
LIGNA 2021, 10 - 14 May

PAR-Duo®

Gluing Line for 2-layer wood flooring

Logo CSP Engineering

Exhibitor

CSP Engineering

Exhibitor details
Exhibitor details
Logo PAR-Duo®

Product description

PAR-Duo® is a machine for bonding solid topcoats to 2-layer parquet with D4 waterproof adhesion. Plywood components are bonded endlessly, this way sawing waste is avoided.
Why PAR-Duo® ?
- higher production capacity than PVA presses
- top layers can be fix or variable
- PUR-Hotmelt for perfect bonding
- Fast adjustment of product width and thickness
- Easy to use
- Option: inline calibration of plywood carrier strips

Product website

Hall 17, Stand A66

High-End machines for wood flooring industry

Stored items

0

Advertisement
Server communication error: Item could not be saved.